Capabilities

CapeSym operates out of its 20,000 sq. ft. facilities in Natick, Massachusetts.  Our capabilities include the latest design and performance simulation tools, a large infrastructure of equipment supporting all facets of materials processing and crystal growth, detector module and equipment fabrication, and state-of-the-art test and characterization tools.

  • Materials Processing

    Our materials processing capabilities include a large number of reactive atmosphere purification stations, and tens of crystal growth furnaces, including Bridgman, Czochralski, Float Zone, and Travelling Heater Method furnaces. Our facilities also include capabilities for the application of thin and thick semiconductor and scintillator films for X-ray, neutron, and multi-modal imaging plates. We can handle very challenging purification and synthesis protocols to produce high-performance detector materials.

  • Simulations

    We have decades of experience in developing high-fidelity computational models for thermos-fluid transport in materials processing technologies as well as Monte Carlo simulations of the passage of particles through matter. The thermos-fluid transport simulations are based on continuum models of heat, mass, and momentum transfer and are routinely used in the design of purification and crystal growth equipment and process optimization. Monte Carlo simulations are generally conducted using Geant4 toolkit and are used in the design and optimization of scintillator-based detector modules.

  • Test & Characterization

    Our test and characterization capabilities include all that is needed to characterize scintillator- and semiconductor-based detectors, including

    • X-ray Diffraction for Crystal Orientation

    • I-V, C-V, hot probe, Hall measurement

    • Microscopy: IR and UV-VIS with concomitant spectroscopy.

    • Spectroscopy: FTIR, UV-VIS

    • Deep level transient spectroscopy (DLTS), PICTS set up

    • Radiation detector characterization: electronics, MCA, sources, and standards; Long term device evaluation set ups, DAQ and PSD analysis.

    • Oxygen analyzer (Eltra)

    • Wet etching, photolithography, thermal evaporator, sputter-coater

    • Environmental chamber –70 to +200C

    • Xtalscope: a versatile microscope-based instrument for rapid wafer-scale measurement of

    - Counting and sizing of etch pits and surface defects (> 400 nm)

    - Substrate interior imaging with NIR microscopy

    - Counting and sizing of 2nd phases in the interior (> 1 µm)

    - Non-contact mapping of wafer thickness uniformity

    - NIR birefringence imaging of the interior

    - High-resolution maps of NIR transmissibility

    - High-resolution maps of lattice constant uniformity

    - High-resolution maps of precipitate statistics